TSMC Unit Acquires $12.7 Million in Fixed-Income Securities; July Bond Issuance Detailed

Taiwan Semiconductor Manufacturing Company’s (TSMC) finance arm, TSMC Global, expanded its asset portfolio on Monday, while the parent company disclosed its July shareholding changes and new bond issuances.

TSMC Global, a wholly owned subsidiary of TSMC, purchased NT$385 million (approximately US $12.7 million) in fixed-income securities on August 25, 2025, according to a brief Reuters filing. The acquisition underscores TSMC’s broader strategy of diversifying its financial assets amid continued investment in capital-intensive chip manufacturing.

In a separate disclosure filed with the U.S. Securities and Exchange Commission on the same day, TSMC reported that Jonathan Lee, Vice President, slightly increased his holdings by 346 shares-rising from 459,526 to 459,872 shares as of July 31, 2025. No other directors, officers, or major shareholders holding more than 10 percent reported changes in pledged shares.

The SEC filing also outlined TSMC’s July bond issuances under its 114-3 series:

• Tranche A: NT$8.3 billion coupon at 1.92 percent, maturing between July 2025 and July 2030.
• Tranche B: NT$4.0 billion coupon at 2.05 percent, maturing between July 2025 and July 2035.

Both tranches are unsecured bullet-repayment bonds with annual interest payments. During July, TSMC and its subsidiaries also allocated NT$10.2 billion to fixed-income investments and disposed of NT$0.4 billion in similar assets.

These financial maneuvers come as TSMC continues to ramp up global capacity-including advanced-node fabs in Arizona-and navigate changing macroeconomic conditions and subsidies under the U.S. CHIPS Act.